Aehr Test Systems' wafer-level burn-in is turning from a niche silicon-carbide test into an indispensable, high-margin bottleneck for AI accelerators. As AI chips grow denser and add multi-die HBM stacks, testing dies before costly advanced packaging prevents heavy yield losses from early failures. Aehr won a $22 million follow-on order for FOX XP systems from its primary AI processor customer, shipping to Taiwan over six months, while running benchmarks for more chipmakers and hyperscalers. x.com