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Terry

Private Fund Portfolio Manager & Trader

26 Aug, 06:27Latest

Chinese PCB makers such as XingSen, Shennan Circuits, Victory Giant and WUS Printed Circuit should be the first in AI hardware to see capacity expansion pay off, in the third quarter. Most AI expansion lands in the second half of next year, when supply should balance or exceed demand, so the next two quarters are the earnings window, and firms that expand and profit first will hit new highs first. Thin volume and macro risks, from Nvidia's earnings to the Fed, may cap rebounds until Q3 results. x.com

8 Jul, 08:53

The PCB and CPO selloff looks more like a buying opportunity than a broken thesis, because markets are treating delays as cancellations. SemiAnalysis's debate is about engineering difficulty: Nvidia's Kyber NVL144 rack may slip on complex midplane PCB manufacturing, and CPO volume may come later than 2026-2027. The issue is ramp timing, not direction. AI's bottleneck is spreading to PCBs, optics and packaging, and hard engineering means high barriers and excess profit once panic selling clears. x.com

Bill Brooklyn

Capital Preservation, Asymmetric Risk/Reward, Holding Winners

29 Oct

GOOGL

NVDA

TSM

MRVL

VRT

PLTR

AVGO

AI infrastructure bottlenecks could give eight stocks as much as 18x upside. Nvidia supplies frontier-model GPUs; Broadcom and Marvell supply custom silicon and networking; TSMC makes advanced chips; Micron supplies sold-out HBM; Vertiv provides power and cooling; Palantir monetizes enterprise AI; Alphabet spans TPUs, research, cloud and apps. The list tracks where AI infrastructure spending is flowing. x.com x.com

Lemon

A-Share/HK/US Equity Commentary, Ex-HSBC Investment Banker

23 Jul

002463.SZ

300502.SZ

AI hardware suppliers such as Eoptolink and WUS Printed Circuit benefit as Google borrows to keep pouring money into AI, even though that spending hurts Google itself. Google raised full-year capex guidance to $195-205 billion, above expectations, while its free cash flow turned negative for the first time at -$5.86 billion. Google fell 7.9% but US AI hardware rose, with Micron up 3%, so China's optical-module and PCB names should rebound rather than be dumped on the Nasdaq's 2.8% drop. x.com

Nicholas Mugalli

Institutional TMT & Macro Research, AI/Semiconductors/Policy

15 Oct

SMH

TSMC's latest results point to AI chip demand still running ahead of supply, supporting the semiconductor and equipment trade. Cantor says TSMC raised its 2026 revenue outlook again, guided December-quarter sales above consensus and held 65-67% gross-margin guidance through the N2 ramp; its bullish sector read names Nvidia, Broadcom, AMD, ASML, Applied Materials, Lam Research and KLA. Jensen Huang says AI labs need not reach trillions in revenue to justify the buildout. x.com x.com

Quality Equities

Quality Equity Investor, Concentrated Portfolios

17 Oct

NVDA

Nvidia's capacity commitments argue against AI orders drying up soon. Its filings show mostly memory and manufacturing commitments rising from $119 billion to $279 billion in one quarter, with about $175 billion covering 2027-28. Fewer new data-center projects could reflect power, land and building bottlenecks rather than weaker demand; a mid-teens multiple still reflects a fair worry that profits may not last. x.com

simple investing

Fundamental Equity Portfolio Manager, Outperforming the Market Newsletter

29 Jul

SMH

AI semiconductor stocks are falling because valuations priced in too much growth beyond 2026-27, not because fundamentals are worsening. With the sector ETF up more than 100% year to date at one point, Q2 earnings couldn't meet those expectations, and a crowded trade is deleveraging as everyone races for the same exit. Fundamentals are likely improving, so as positioning and valuation reset the trade can continue, but selectively. x.com

M Mohan

Private Equity at IncVangal, Former Microsoft Ventures Director

18 Sep

000660.KS

The market is selling AI infrastructure on pause fears while the cleanest demand read on the planet prints records, which favors SK hynix and Micron. Korea shipped $16.5bn of chips in 10 days, 3.5x last year's pace. x.com

Tae Kim

AI/Semiconductor Journalist, Author of Key Context

6 Sep

2317.TW

Foxconn, Nvidia's AI server maker, should outperform as AI demand keeps growing. On September 5, 2026, Foxconn said third-quarter operations should gain momentum as ICT products enter their second-half peak season, that visibility has improved from the prior month and that overall performance is expected to beat market expectations. x.com

Jason Luongo

Growth-Stock Options Trader, LEAPS & Income Strategies

28 Sep

NBIS

NVDA

TSM

VST

AMD

These ten companies span every layer of AI capex, which Goldman sees surging to $1.2 trillion in 2027, so each should make money. Credo, Broadcom, Micron, Nvidia, TSMC, AMD and Amkor cover connectivity, custom chips, memory, GPUs, foundry and packaging; Broadcom expects AI revenue of about $115B in fiscal 2027. Vistra supplies power under 20-year nuclear contracts. IREN and Nebius rent AI compute, with Nebius targeting $7-9B run-rate revenue by year end. x.com x.com x.com x.com x.com x.com x.com … Show more

SuperLuckeee

Day & Swing Trader, Options/Futures & Credit Spreads

1 Jun

IBM

NOW

AMD

AVGO

ARM

Dominant AI companies are worth owning through volatility over 6-24 months, giving them time to execute. AMD is gaining accelerator share, Oracle's AI cloud demand is exploding, ServiceNow has a sticky platform with pricing power, Nvidia's demand still exceeds supply, and Microsoft monetizes AI across cloud and software. Arm, Broadcom, IBM, Dell, Datadog, Apple and Qualcomm each ride AI through chip design, networking, enterprise adoption, servers, observability, device upgrades and edge AI. … Show more

Davy

Small-Cap Investor, Archetype-Research, Undercovered Companies & Data-Center Supply Chains

2 Jul

TSM

As custom AI chips become normal, the scarce asset may be the capacity to build them, since every design passes through the same packaging, substrate, PCB material and manufacturing bottlenecks. Meta with MediaTek and Amazon with Alchip show chip design going modular. That favors TSMC for manufacturing, Alchip for ASIC back-end work, Samsung Electro-Mechanics, Ibiden and AT&S for high-end substrates, and Shengyi Technology if AI PCB material stays tight. The bottleneck map widened. x.com x.com

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