Flex should dominate next-generation chip cooling for a few years because JetCool can cool 3 kW in-package, which no one else on the market can. It has a Broadcom deal to co-design cooling for all its ASICs and could become Nvidia's cooling-block design partner around Vera Rubin Ultra or Feynman. Higher Feynman voltages will drive massive cooling demand, and packaging spanning more reticles means more hot-spot cooling. Flex was obviously mispriced and will be a new company going forward. x.com x.com x.comÂ








