The selloff in ASML and BESI on China's new immersion DUV tools is an overreaction with minimal real impact. China plans five units this year and 20 in 2027 for SMIC, Hua Hong and CXMT, under 4% of ASML's roughly 130 annual immersion DUV shipments. DUV can make 7nm chips via multi-patterning, but at higher cost, lower capacity and more alignment errors, and EUV is a fundamentally different technology. Nikon and Canon face the most pressure. x.com

