Amkor's expansion in advanced packaging supports a bullish growth outlook as that work becomes more important. Packaging accounts for 88% of sales and computing revenue rose 25%; capacity spending explains negative free cash flow. Q3 EPS was $0.76, implying roughly 12x annualized earnings, while Q4 EPS guidance is $0.65-$0.75. The compute opportunity is only starting, despite the decline in mobile. x.com  x.com  x.com  x.com 

Customer prepayments of about $3.2B for Amkor's capacity exceed its roughly $2.5B planned capex this year, funding the buildout ahead of delivery. Buy, with a $48 target. x.com 

Amkor Technology looks expensive against its earnings, trading at 24x trailing and 19x next year's versus the roughly 18x chip-equipment makers usually get. At 18x mid-cycle EPS of $1.87, give or take 12%, fair value is $29.54-$37.60, putting the $53.86 price 43% above the top of that range. The view uses reported earnings and estimates only, without fundamental work. x.com 

Amkor Technology's story is only beginning, as a smaller version of TSMC. Expect steady, consistent growth over a horizon longer than the end of 2027, not a quick 2-3x. x.com  x.com 

Amkor's Nvidia advanced-packaging agreement gives its Arizona expansion a $1.5B multiyear commitment. Q2 sales rose 26% to $1.90B, with record computing revenue; Q3 results are due October 26. x.com 

Amkor's underwhelming guidance is not the kind of sign seen at a bottom. x.com 

Amkor is the leading independent way to own advanced packaging, now the enabling technology for AI chips; overweight, $85 target. Advanced packaging is 75-80% of sales. Growth should beat the industry on AI demand, customers diversifying away from Taiwan and China to Amkor's global footprint, share gains and rising complexity. The target assumes about 32x $2.65 of exit-2026 earnings power versus peers at 26x. Risks: 2.5D capacity execution, customer concentration and the Kim family stake. x.com 

Amkor's drop of more than 30% from its high looks ridiculous after NVIDIA, TSMC and AMD picked it within two months. Amkor packages, stacks and tests finished wafers, and advanced packaging has become one of AI's key bottlenecks. Almost all of it happens in Asia, and Amkor is basically the only US name doing it at scale, so reshoring and CHIPS Act money flows its way. It signed a 10-year packaging deal with TSMC in Arizona and a $1.5B multi-year NVIDIA deal, with NVIDIA prepaying for capacity. … Show more

Amkor's operating leverage is kicking in, as rising utilization and outsized advanced-packaging demand let each new revenue dollar drop to profit at a far higher rate than a year ago. Its best quarter in years beat on both lines with records in AI end markets. Catalysts include a 10-year packaging deal with TSMC, a multi-year Nvidia partnership with prepayment for US capacity, a ramping HDFO data-center CPU program, and guidance for higher revenue and a meaningful gross margin jump. x.com 

Amkor could fill its underused traditional packaging capacity, such as in the Philippines, at higher prices if a reported shortage materializes, lifting nearer-term revenue. IC design insiders say packaging providers have warned clients of a traditional packaging capacity deficit exceeding 20% by 2027, as AI server shipments drive demand for mature chips and absorb existing capacity. The main ramp still comes in early 2028 in Arizona, once TSMC and Nvidia work there takes off. x.com  x.com