Amkor could fill its underused traditional packaging capacity, such as in the Philippines, at higher prices if a reported shortage materializes, lifting nearer-term revenue. IC design insiders say packaging providers have warned clients of a traditional packaging capacity deficit exceeding 20% by 2027, as AI server shipments drive demand for mature chips and absorb existing capacity. The main ramp still comes in early 2028 in Arizona, once TSMC and Nvidia work there takes off. x.com x.comÂ
