The memory cycle still has plenty of demand ahead for Micron and SanDisk, but recurrent depth is a technical challenge to the HBM trade. Nanbeige 4.2 3B runs a 22-layer stack twice, nearly doubling compute while the memory holding its weights stays the same; Sebastian Raschka notes it kept about 75% of standard token efficiency. KV cache and bandwidth needs still grow. If AI can reuse memory for twice the work, each gain may need fewer extra memory chips than investors expect. x.com x.comÂ

