Next-generation AI systems could double wafer demand, keeping the long-term outlook compelling for semiconductor equipment makers. Applied Materials targets more than $12 billion in services revenue and roughly 40% operating margins by 2030; management expects over two points of share gains and potentially more than $5 billion in advanced-packaging revenue, driven by HBM and AI demand. Bullish on Applied Materials, Lam Research, ASML and KLA. x.com 

Per FTR Investors, Applied Materials' larger stake strengthens BE Semiconductor's partnership in hybrid bonding and advanced AI chip packaging, supporting a bullish view. Applied Materials is increasing its stake from 9% to about 20%. x.com 

Excess data-center capacity makes Applied Materials look cooked because it is mainly tied to DRAM-manufacturing equipment. x.com 

Leading-edge wafer demand is bullish for semiconductor equipment makers because TSMC is already at over 100% utilization on those nodes. Per Ben Bajarin, rack-scale pods drive more wafers across categories. Close collaboration at the leading edge also gives equipment makers and TSMC visibility into plans years ahead. x.com  x.com 

Applied Materials' larger stake in BE Semiconductor points to long-term hybrid-bonding potential despite delayed adoption in HBM. Applied agreed to raise its BESI holding from 9% to about 20%; HBM adoption timelines may not reflect the prospects for the technology as a whole. x.com  x.com 

Applied Materials looks expensive against its earnings at $511.75, or 29x next year's earnings, versus the usual 18x for chip-equipment makers. An 18x multiple on forward EPS of $17.91 gives a fair range of $283.64 to $360.99, leaving shares 42% above the high end, and the forward read leans on forecasts 54% above trailing. The view uses levels only, from reported earnings and revenue estimates. x.com 

ASE Technology's packaging tightness now extends beyond AI to analog and mature-node chips, supporting price hikes. Lead times are up over 30%; FC/Wirebond/QFN hikes of 10–80% and CoWoS hikes of 10–20% are expected in 3Q–4Q26. Higher AMD server CPU wafer allocation, CoWoS adoption for Venice, Verano and future AMD CPUs, and limited competition support LEAP growth. LEAP revenue is forecast at US$4bn/$8bn in 2026/27, above guidance. The target rises to NT$843 from NT$754 on 25x 2027E EPS. x.com 

Inference's move toward edge devices and dense, memory-hungry racks should drive demand for specialized chips, links, power delivery and cooling. McKinsey projects inference at 60% of AI computing demand by 2030. Ambarella makes on-device AI chips; Astera Labs links GPUs, memory and networks; Credo supplies short copper connections; Rambus earns from memory interfaces; Navitas reduces power waste; Modine cools dense racks; and Super Micro builds inference-specific server racks at volume. x.com  … Show more

Semiconductor equipment makers such as Applied Materials, KLA and Lam Research look like shorts, a view Michael Burry now shares: per @zerohedge, Burry says he shorted Applied Materials, along with Tesla, Nvidia and, for the first time, Caterpillar. x.com 

Front-end chip-equipment makers ASML, Applied Materials, Lam Research and KLA are receiving a near-doubling of TSMC's equipment plan the market has not yet priced. Per TSMC's Cliff Hou, its 2026 equipment purchase plan rose from 1X to 1.5X within a quarter and 1.9X by July, a payment-backed commitment rather than a forecast. It is a relative multiple, not a capex figure. SEMI cites about 70 fabs under construction, yet all four stocks fell pre-market. x.com