Damnang
Semiconductor Engineer in Silicon Valley, AI Chip Investment Research
3D-stacked DRAM could constrain bit output even more than today's HBM, preventing memory oversupply beyond 2030. HBM demand already diverts capacity from conventional DRAM; logic-integrated stacks could add pressure if they scale around 2029-30. That comparison depends on the architecture being understood correctly, and memory makers have not settled the DRAM process nodes. x.com
3D-stacked DRAM could further constrain conventional DRAM supply beyond HBM's existing manufacturing burden. A memory-equipment discussion points to actual density, yield and cost per bit, rather than 4F² or 6F² labels alone, as the test of new designs. NVIDIA's alliance with SK hynix looks stronger than expected, but Rubin and Rubin Ultra are still evaluating both 8-high and 12-high stacks; a smooth HBM4E transition and validation remain hopes. x.com x.com x.com x.com
Memory remains structurally scarce because SK hynix says conventional DRAM and HBM are practically sold out through 2029, while customers request roughly twice the HBM volume it can produce. Long-term agreements cover more than half of 2027 and 2028 capacity, and the company expects the supply-demand imbalance to persist through 2030. x.com x.com
Memory supply looks constrained through at least 2030 because HBM, vertical HBM and vertical edge-inference memory require more wafers per bit than standard DRAM. Micron's roadmap shows that wafer pressure persisting as those products arrive; its illustrative product timing remains subject to change. x.com
HBM stack height should leave excess DRAM wafers, driving the current memory short. The short this time is specifically about HBM, not all memory. x.com
Prepaid contracts and demand-paced fabs weaken a broad 2028 memory-glut case. SK hynix says over half its 2027-28 capacity is signed with deposits; 'sold out through 2029' includes negotiations. Samsung targets 60-70% contracted capacity. Micron's three projects begin output in 2H28; tooling follows demand. Reuters says CXMT's 20-30%-yield HBM3E may ship this year to export-restricted Chinese buyers, but performs like older HBM3. Commodity DRAM risks 2028-29 oversupply; NAND could ease in 2H27. … Show more
SK hynix's stronger pricing and contracted demand support the still-favored memory duration trade. DRAM and HBM capacity is sold out through 2029, and a supply-demand imbalance is expected through 2030. More than half of 2027-28 capacity is under long-term agreements, with agreed 2027 HBM prices significantly higher year on year. Guangfa HK expects fund flows and bearish sentiment to improve after earnings. x.com
Memory prices look to be at their peak for SK hynix and Micron as Chinese commoditization catches up. CXMT has made HBM3E and is now only one generation from HBM4, so China will scale its own DRAM and HBM production. Over several years, supply and innovation have always caught up with demand in past cycles, and US work on memory architectures that work around HBM or use less of it is already well underway. That contradicts @jukan05's reading that CXMT's progress tightens commodity DRAM. x.com … Show more
Shorter HBM stacks are not reducing demand for SK hynix's HBM, because customers are redesigning AI accelerators around limited supply. On its call, management said lower stacks let customers build more accelerators; supplying the same bit volume then requires more packages, base dies and back-end processing. Denser dies can offset some lost layers, and SK hynix says customer volume requests exceed twice its current supply. x.com
More memory CapEx may yield proportionally fewer bits as HBM consumes more wafer capacity, supporting SK hynix and Samsung's pricing. Both reported double-digit quarterly DRAM and NAND price gains; Samsung targets 60-70% of mid- to long-term capacity under LTAs. SK hynix has the stronger execution record, but Samsung could benefit enormously from conventional memory without winning HBM4. If trends persist, normalized margins could rise, though memory remains cyclical. x.com
SK hynix and other Korean memory makers' aggressive price hikes invite customers to optimize memory use, undermining the case for 90% margins despite a long-term shortage. Memory is the only layer raising cost per token. Elon Musk described Micron's future pricing as reasonable and other suppliers' as extortionate, warning that today's customers would not forget; exorbitant long-term contracts compound that risk. x.com x.com
SK hynix's enforceable long-term supply commitments add visibility to memory profits. It says DRAM and HBM volumes through 2029 are effectively sold out, with agreements covering over half of 2027-28 capacity while retaining pricing flexibility. Operating profit beat expectations at $62.8B versus about $58B, and SK hynix announced $75B in 2026 shareholder returns. It expects the memory shortage to persist through 2030. x.com
