Nvidia's proposed common NVHBM base die would make Micron, SK hynix and Samsung more interchangeable, weakening their pricing power. Seoul Economic Daily reports Nvidia wants all three to fabricate it at TSMC; Samsung reportedly agreed. Standardization would ease validation and order shifts. The risk lessens if SK hynix or Micron retain their own logic or NVHBM stays a small share of Nvidia's purchases. x.com 

TSMC gains leverage in custom HBM because Nvidia reportedly standardized its NVHBM base die on TSMC's 3nm process, even for Samsung's stacks. Seoul Economic Daily reports Samsung accepted while retaining its own 4nm base dies for standard HBM4/HBM4E and AMD custom HBM, and validating a fallback for Nvidia. That weakens Samsung's all-in-one memory, foundry, packaging and photonics pitch to Nvidia, though its bundle can still serve other customers. x.com 

TSMC's conservative delay in high-NA adoption will be its downfall as Intel's stitching advances sooner. TSMC's larger-mask alternative requires changing the entire stage and is projected for production by 2033; Intel's stitching is substantially derisked and could be ready for volume production in 2027 at the earliest. TSMC's CoWoS and CoPoS shortcomings add to the concern. x.com 

Higher HBM stack requirements favor Samsung Electronics shares, even as the broader semiconductor industry suffers and DRAM is in dire straits. Daishin Securities says plans for 4-high and 6-high HBM in low-end inference appear shelved, while Nvidia's 8-high Rubin option appears dropped amid base-die supply constraints and customers' preference for bandwidth. x.com 

A memory-chip shortage lasting until 2030 is good for Nvidia. SK hynix expects that shortage and reports a 632% profit jump. x.com 

TSMC may lose pricing power as performance gains shift from shrinking transistors to stacking, interconnects and optics, while logic folding could make older processes competitive. Despite strong leading-edge demand, investors may overestimate the profit share its node leadership can retain. Its cautious expansion and past reluctance toward advanced packaging suggest a risk-averse culture that protects returns but could leave it late to disruptive technologies and key customers. x.com 

Samsung Electronics' HBM4 pricing looks set to lead the memory Big Three, helping make next year's earnings phenomenal. Samsung memory EVP Jaejune Kim said next year's HBM supply is sold out at target prices, with more customer requests coming. Korean media had reported quotes in the mid-to-high $4/Gb range; Nvidia appears to have accepted Samsung's asking price. Samsung-equipped Rubin variants should sell as separate premium-priced SKUs against SK hynix or Micron versions. x.com 

Samsung's HBM4 ramp makes SK hynix's ability to defend its HBM lead the key question in the memory race. Chosun Biz reports SK hynix's HBM4 shipments may have missed expectations for a second straight quarter amid Nvidia Rubin delays and chip tuning. Counterpoint puts Samsung's Q2 HBM share at 33%, up from 21%; TrendForce expects strong SK hynix Q3 profits. Samsung is the preferred memory stock right now, though there may be no single clear winner. SK hynix's October 28 report is the next check. … Show more

NVIDIA, Broadcom, Micron and TSMC should be worth less because AI risk has risen while the expected reward has not. The CEOs of Anthropic, OpenAI, SpaceX and Tesla have said AI risks killing all humans and needs to slow down, yet not a single analyst cut ratings or price targets on these chipmakers. In game-theory terms, higher risk with the same reward makes the bet worse. x.com 

Micron, Samsung Electronics and SK hynix look very cheap if their long-term agreements do not impose overly conservative price ceilings. Greater clarity on those pricing terms could send memory stocks up 30% in a single day. x.com