ASE Technology's packaging tightness now extends beyond AI to analog and mature-node chips, supporting price hikes. Lead times are up over 30%; FC/Wirebond/QFN hikes of 10–80% and CoWoS hikes of 10–20% are expected in 3Q–4Q26. Higher AMD server CPU wafer allocation, CoWoS adoption for Venice, Verano and future AMD CPUs, and limited competition support LEAP growth. LEAP revenue is forecast at US$4bn/$8bn in 2026/27, above guidance. The target rises to NT$843 from NT$754 on 25x 2027E EPS. x.com 

ASE Technology should hit a new high within a couple of quarters even though it got ahead of itself, because advanced packaging is insanely important. Its EPS is expected to rise from $0.44 in 2025 to $1.80-2.00 next year. x.com 

Amkor's expansion in advanced packaging supports a bullish growth outlook as that work becomes more important. Packaging accounts for 88% of sales and computing revenue rose 25%; capacity spending explains negative free cash flow. Q3 EPS was $0.76, implying roughly 12x annualized earnings, while Q4 EPS guidance is $0.65-$0.75. The compute opportunity is only starting, despite the decline in mobile. x.com  x.com  x.com  x.com 

NVIDIA's projected earnings growth could support substantial upside without an enormous multiple. At $221.97 it trades at 10.4x estimated FY2029 earnings; even at $350, nearly 58% higher, it would trade near 16.4x. Estimates imply roughly 130% cumulative EPS growth over the next two fiscal years and may be conservative. SpaceX and Meta earnings look bullish for future chip demand. Slower AI spending, margin pressure or competition could undermine the estimates. x.com  x.com 

Networking, power and compute look more durable than cyclical memory in the AI buildout. Lumentum's revenue compounded year after year across the 2010s and 2020s, unlike Micron's; AWS revenue also compounded. Lumentum, Nebius, Bloom Energy and Credo should heavily outperform SanDisk and Micron from here, though AI itself remains heavily doubted. x.com  x.com 

As AI chips grow more complex, packaging becomes more valuable, which favors ASE Technology, the world's largest outsourced chip packager. Its offering spans 2.5D/3D, HBM integration and next-generation packaging. Q2 revenue rose 27% year over year while EPS nearly tripled, and the chart shows a massive cup pattern. x.com 

Semiconductor trade faces a capex growth ceiling even if AI delivers what bulls expect. Spending cannot compound at 70-100% a year indefinitely, and compute per dollar roughly doubles every two years, so the same budget buys more capacity later. Today's chip valuations also demand years of 20% AI earnings growth beyond 2028: roughly 10.9 extra years for AMD, 8.9 for ASML, 7 for Marvell and 6.4 for TSMC, versus 1.6 for Broadcom and 0.8 for Nvidia; Micron needs none under the chart's assumptions. … Show more

ASE is a long on advanced packaging, as it eyes doubling its leading-edge advanced packaging revenue by 2027. @Colosteve2000 adds that, given the earnings call, a 4x would not be surprising if ASE can bring production up to par fast enough. x.com  x.com 

Amkor's Nvidia advanced-packaging agreement gives its Arizona expansion a $1.5B multiyear commitment. Q2 sales rose 26% to $1.90B, with record computing revenue; Q3 results are due October 26. x.com 

Low multiples give AI infrastructure good risk/reward as demand outruns supply and agentic workloads have runway. TSMC at 17x 2027E EPS appears to have all the accelerator and CPU demand it can handle this year and next; Ultra Clean is at 8x, MKS 12x, TTM 13x, Nvidia 14x and Celestica 15x. Kioxia at 3x and Samsung preferreds at 2.5x carry a big discount on pricing and cycle fears. Multiples imply a 2027 capex peak and meaningful drop; 2028 capex growth is expected, but below 2027's rate. x.com  … Show more