ASE Technology's packaging tightness now extends beyond AI to analog and mature-node chips, supporting price hikes. Lead times are up over 30%; FC/Wirebond/QFN hikes of 10–80% and CoWoS hikes of 10–20% are expected in 3Q–4Q26. Higher AMD server CPU wafer allocation, CoWoS adoption for Venice, Verano and future AMD CPUs, and limited competition support LEAP growth. LEAP revenue is forecast at US$4bn/$8bn in 2026/27, above guidance. The target rises to NT$843 from NT$754 on 25x 2027E EPS. x.com 

ASE is a long on advanced packaging, as it eyes doubling its leading-edge advanced packaging revenue by 2027. @Colosteve2000 adds that, given the earnings call, a 4x would not be surprising if ASE can bring production up to par fast enough. x.com  x.com 

As AI chips grow more complex, packaging becomes more valuable, which favors ASE Technology, the world's largest outsourced chip packager. Its offering spans 2.5D/3D, HBM integration and next-generation packaging. Q2 revenue rose 27% year over year while EPS nearly tripled, and the chart shows a massive cup pattern. x.com 

ASE Technology is the layer beneath the Nvidia trade, as advanced packaging becomes a differentiator rather than an afterthought. The largest outsourced assembly and test player packages dies from TSMC and Samsung, and its SPIL unit is a major Nvidia AI-chip packaging supplier. Leading-edge packaging revenue rose 167% to $1.6B in 2025, guided to about $3.2B in 2026. Heavy capex will pressure near-term margins, and at about 28x forward earnings after a 220% rise, it is priced for execution. x.com 

ASE's panel-level packaging implementation for AMD's Venice CPU gives both companies a reason to do great in the coming years. Per SemiAnalysis, ASE and its subsidiary SPIL implemented second-generation fan-out embedded bridge technology for Venice, with limited initial production targeted for Q1 2027. A 310 mm panel fits 25 interposers versus 22 on a 300 mm wafer, a modest 14% gain rather than a dramatic cost reduction. x.com 

Amkor's expansion in advanced packaging supports a bullish growth outlook as that work becomes more important. Packaging accounts for 88% of sales and computing revenue rose 25%; capacity spending explains negative free cash flow. Q3 EPS was $0.76, implying roughly 12x annualized earnings, while Q4 EPS guidance is $0.65-$0.75. The compute opportunity is only starting, despite the decline in mobile. x.com  x.com  x.com  x.com 

Cadence's IBD composite and EPS ratings of 90 support its standing as arguably the best in the 'making chips better' group after ASML. The screen estimates 2026 EPS growth of 18% and sales growth of 21%. Its chart is near a breakout after a long pullback. x.com 

Celestica's demand for AI hardware and the components connecting it looks strong enough to support an almost doubling in its 2027 guidance figures. The company guides to $40 billion of revenue and $21.50 of adjusted EPS for 2027; Wall Street's consensus price target implies nearly 100% upside. Per @firesidealpha, Celestica's M. Chawla says customers are awarding 2028 programs on silicon not yet developed, with conversations extending into 2029 and 2030. x.com  x.com 

Unimicron should benefit from a persistent AI ABF substrate shortage and a shift toward higher-end products. Its projected share exceeds 30% as the market reaches $13bn/$18bn in 2027/28; added capacity is expected to lift ABF revenue 66%/90%. Higher-end ABF, mSAP and LPDDR lift margins, supporting 77% EPS CAGR. Initiate Buy with a NT$1,820 target at 30x 2027 earnings. x.com 

KLA gains as more complex AI chips require more inspection before they ship. 3D stacking, advanced packaging and 2nm processes multiply checks in a market KLA says it owns almost entirely. Revenue rose 29% and EPS 39%; the next-quarter revenue guide of $4.7bn exceeds the $4.54bn expected, showing the promised second-half acceleration. Overweight, $300 target. x.com  x.com