Unimicron's profit leverage to rising ABF substrate prices should stay significantly positive and last longer than the market expects, even if customers absorb only part of the increases. As a high-end ABF leader, its high fixed costs and utilization leverage limit any squeeze from costlier T-glass. The T-glass bottleneck and long capacity cycles could extend the benefit for a year or two, and its high Nvidia and ASIC share adds pricing power, though execution on hikes and utilization matters. … Show more

Rising substrate prices could leave Unimicron's earnings estimates too low. It could earn over $2B in 2027; while no longer as cheap as a year ago, around 40x next-twelve-month EPS still looks reasonable, with 3,000 possible by end-2028. x.com  x.com  x.com 

Micron's sold-out high-bandwidth memory through 2027+ and contracts already being signed for 2029-2030+ extend its earnings runway. At 5x forward earnings, it is cheaper than a year ago; its private Anthropic stake is about to be instantly rerated at Anthropic's IPO, and a new share buyback is expected to be announced Dec. 9. Micron could certainly gain 30% in three months. x.com  x.com 

Micron and SK hynix pricing in a memory shortage past 2030 extends the memory-cycle case beyond the Street's 2028 expectation. SK hynix's record quarter adds evidence: per Wall St Engine, revenue rose 328% to $78.9B, operating profit rose 632% to $62.8B, and operating margin hit 80%. Agentic and physical AI could add demand as they roll out. x.com  x.com 

IC substrates are Schmid's more relevant growth driver today because demand is already high and rising. Schmid customers Ibiden and Unimicron are expanding capacity with NVIDIA support; higher order intake supports the prospect of more equipment orders. Its balance sheet has improved, and the risk/reward looks attractive at current levels despite volatility. Glass substrates may take another one to two years to matter commercially. This is a personal assessment, not a buy recommendation. x.com  … Show more

Next-generation AI systems could double wafer demand, keeping the long-term outlook compelling for semiconductor equipment makers. Applied Materials targets more than $12 billion in services revenue and roughly 40% operating margins by 2030; management expects over two points of share gains and potentially more than $5 billion in advanced-packaging revenue, driven by HBM and AI demand. Bullish on Applied Materials, Lam Research, ASML and KLA. x.com 

Taiwan equities bundle real AI chokepoints with pricing power and no near-term substitutes for about 21x forward earnings, versus about 30x for US semiconductors. TSMC holds about 90% of sub-7nm manufacturing and is raising CoWoS prices; Unimicron and Elite Material control ABF substrates and CCL; ASE runs advanced packaging above 90% utilization; Delta supplies power and cooling for 120-230kW racks at 30-40% lower cost than Western rivals. Taiwan also offers lower beta and volatility. x.com  … Show more

Rack-scale AI pods need more wafers and advanced packaging, favoring Applied Materials' equipment portfolio. Applied's slides model two to four times as many wafers per agentic pod; the company says it leads HBM packaging process steps and expects over $2.4 billion in advanced-packaging revenue in 2026. Wiring uses about half of chip power, adding a need for equipment innovation. Applied's WFE share should grow; its optics opportunity depends on scale toward the end of the decade. x.com  x.com  … Show more

Micron's numbers have already validated the thesis, and the memory cycle still looks extremely tight. Fiscal Q3 revenue was $41.46B versus $9.30B a year earlier, non-GAAP EPS reached $25.11 and adjusted FCF $18.3B, with cloud memory and core data center gross margins of 83% and 87%. Micron is shipping HBM4 in volume, with HBM4E due in 2027, while industry reports point to worsening DRAM and NAND shortages as AI consumes enormous amounts of memory. x.com 

Amkor is the leading independent way to own advanced packaging, now the enabling technology for AI chips; overweight, $85 target. Advanced packaging is 75-80% of sales. Growth should beat the industry on AI demand, customers diversifying away from Taiwan and China to Amkor's global footprint, share gains and rising complexity. The target assumes about 32x $2.65 of exit-2026 earnings power versus peers at 26x. Risks: 2.5D capacity execution, customer concentration and the Kim family stake. x.com