Applied Materials' larger stake in BE Semiconductor points to long-term hybrid-bonding potential despite delayed adoption in HBM. Applied agreed to raise its BESI holding from 9% to about 20%; HBM adoption timelines may not reflect the prospects for the technology as a whole. x.com  x.com 

Per FTR Investors, Applied Materials' larger stake strengthens BE Semiconductor's partnership in hybrid bonding and advanced AI chip packaging, supporting a bullish view. Applied Materials is increasing its stake from 9% to about 20%. x.com 

ASMPT should outperform BE Semiconductor over the next two years because hybrid bonding for HBM has slipped toward 2028, keeping older bonding in use longer. At Hot Chips 2026, SK hynix signaled it will extend MR-MUF through 16-high HBM4; per Yole, wafer-to-wafer hybrid bonding arrives around 2028. ASMPT specializes in the conventional bonding that is sticking around; BESI loses its main near-term driver. BESI is no slam-dunk short, since Intel's Diamond Rapids uses hybrid bonding in chiplets. … Show more

Logic folding could create more hybrid-bonding demand for BE Semiconductor than shorter HBM stacks take away. Customers are requesting four- or six-die stacks because HBM is expensive; fewer layers need fewer bonding steps and fit packages more easily with conventional solder, weakening the near-term HBM opportunity. Vertically stacked logic still needs exceptional alignment as it shortens signal paths and cuts energy use. x.com 

BE Semiconductor Industries is a good long on its supply-chain importance, as recent Lam Research and Applied Materials news validates how important hybrid bonding is to advanced packaging. Upside looks more limited, though; it is unlikely to rise 300% like names such as Applied Optoelectronics. x.com 

Cadence's IBD composite and EPS ratings of 90 support its standing as arguably the best in the 'making chips better' group after ASML. The screen estimates 2026 EPS growth of 18% and sales growth of 21%. Its chart is near a breakout after a long pullback. x.com 

Broadcom's stronger AI business looks cheap for its growth, making it one of the best buys in the market right now. AI chip revenue rose 221% to $16.7B last quarter, yet the stock trades at 19x forward earnings and a 0.35 PEG. Management sees AI revenue near $115B in fiscal 2027 and would raise that outlook if customers secure more land and power. Anthropic is on track to be its largest custom chip customer next year. Wall Street's $529 average target implies about 60% upside. x.com 

Higher HBM stack requirements favor Samsung Electronics shares, even as the broader semiconductor industry suffers and DRAM is in dire straits. Daishin Securities says plans for 4-high and 6-high HBM in low-end inference appear shelved, while Nvidia's 8-high Rubin option appears dropped amid base-die supply constraints and customers' preference for bandwidth. x.com 

BESI should see a huge hybrid bonding order wave, especially from HBM4E and HBM5 roadmaps, and its price is compelling after the July selloff. x.com 

Semiconductor trade faces a capex growth ceiling even if AI delivers what bulls expect. Spending cannot compound at 70-100% a year indefinitely, and compute per dollar roughly doubles every two years, so the same budget buys more capacity later. Today's chip valuations also demand years of 20% AI earnings growth beyond 2028: roughly 10.9 extra years for AMD, 8.9 for ASML, 7 for Marvell and 6.4 for TSMC, versus 1.6 for Broadcom and 0.8 for Nvidia; Micron needs none under the chart's assumptions. … Show more