IBM's sub-1-nanometer nanostack chip cements a multi-year capex cycle for lithography and process equipment leaders ASML, Lam Research and Tokyo Electron, which must power the move into the angstrom era. It tackles the two biggest bottlenecks for next-generation AI infrastructure: IBM says it delivers 70% better energy efficiency, vital to cutting data center operating costs, and its 40% denser SRAM is a big leap for memory bandwidth in heavy LLMs. x.com


