CPS Technologies should be the biggest beneficiary as SiC and GaN power-module markets grow about 8x, because its aluminum silicon carbide baseplates solve a problem copper cannot. Baseplates must conduct heat and expand at the same rate as the ceramic above them; copper's mismatch makes it delaminate after about 4,000 thermal cycles. CPS's AlSiC offers 180 W/mK conductivity with a near-matched expansion rate and, per the company, survives tens of thousands of cycles. x.comÂ





