Veeco is a top beneficiary of AI data centers' shift to photonics, as its tools make the indium phosphide lasers inside 800G and 1.6T transceivers and equipment orders lead the chip cycle. It disclosed over $250M of orders for its IBD, MOCVD and WaferEtch systems, shipping from late 2026 and ramping through 2027. Its laser annealing is critical to yields for 3nm and 2nm logic and HBM at makers like TSMC and Micron, and its pending Axcelis merger should add synergies. x.comÂ


