Intel's poor EMIB-T packaging yields threaten its plans for next year. Per a confidential source, yields are very poor, and EMIB-T may now slip into the following year. The 14A PDK 0.9 matters more for the long term. Intel remains a very strong long-term bull case because yields should improve, though setbacks can arise along the way; whether to avoid this near-term risk is a personal judgment. x.com  x.com  x.com  x.com  x.com  x.com 

Intel's EMIB packaging is ramping as advanced packaging becomes the next chokepoint after HBM. EMIB substrate yields reportedly rose from ~30% in 2Q26 to ~45%, with targets of 50% by 4Q26 and 60% by 1Q27. Google is expected to adopt EMIB-T in 2027 and AWS is testing it. CEO Lip-Bu Tan says Intel has to prepay substrate suppliers to secure capacity. CoWoS capacity is set to grow about 20x from 2023 to 370k wpm by 2028, more than TSMC can carry alone. x.com 

Intel's advanced packaging story is already priced in; the stock got there a little too fast. EMIB and EMIB-T are legit, and the foundry pivot gives Intel a real narrative, but the market has moved ahead of it. x.com 

Broadcom's integrated optics, electronics and packaging could lower custom-chip system costs because separate suppliers defend their margins. At similar valuations, it is preferred to Nvidia and has more room to beat expectations. Google TPU v8 shipments are estimated at 4.0M in 2026 and 9.1M in 2027, assuming Broadcom supplies the remainder after MediaTek's allocation. Anthropic financing adds value only if chip profit exceeds likely support payments and capacity costs. x.com  x.com 

Reported talks between SK hynix and Intel to make memory chips in the US are another strong data point for Intel Foundry, though nothing is signed. After multiple leaks of SK hynix looking at EMIB, big players are clearly treating Intel as a real alternative for advanced packaging. A deal would move EMIB from a backup option to core AI infrastructure, offloading packaging bottlenecks to US soil while undercutting TSMC on cost. Volume is not expected before 2027 or 2028. x.com 

Intel's recovery looks fragile because PC softness could persist through at least the first half of 2027. Management's weak Q4 outlook suggests the pressure may outlast one disappointing forecast. x.com 

TSMC sits at the end of the money trail as agentic AI reprices the chip supply chain, and Google's $40 billion Anthropic deal is the clearest proof. That deal is effectively a prepaid inference contract for 5GW of TPU capacity over five years, and every TPU flows through TSMC, where advanced-node demand runs about 3x supply. Agentic AI burns 10-100x more compute per session than a chatbot. CoWoS packaging is the tighter bottleneck, with prices rising 10-20% a year, double logic wafers. x.com  … Show more

Intel's near-term growth is constrained by a Kiryat Gat factory blast and memory-driven PC weakness. The weak Q4 outlook calls for answers: the blast looks set to cut roughly $300 million of revenue in Q4 and could have a similar impact in Q1, limiting data-center growth. Fab ownership gives Intel pricing power and enterprise demand is strong; external foundry customers would add another tailwind if won. CEO Lip-Bu Tan said Nova Lake will allow Intel to take back share. x.com  x.com  x.com  x.com  … Show more

Intel looks priced for too much good news before it has actually delivered on anything. Its CPU story was carrying the share price. x.com 

Advanced packaging is where the new Moore's law lies, and Intel's EMIB is becoming a major business. Per Digitimes, cited by @pequityresearch, the first TPU using EMIB has met yield standards, making it significantly more likely that future TPU generations keep using it. A quoted assessment calls EMIB a multi-billion-dollar-per-customer business with 30% operating margins and phenomenal ROIC, now headed by SK hynix's former CEO. x.com  x.com