LPKF's glass-substrate thesis has barely started even after the stock's run. Its LIDE process drills defect-free through-glass vias at production speed with aspect ratios up to 1:50, and glass is the only material that solves CTE mismatch, dielectric loss and warpage at once, where silicon interposers cannot scale. Over 80% of major players chose LPKF equipment for validation, a de facto standard; first production orders came in Q1 2026, and the 2027 mass-production ramp hits the P&L hard. x.com 

LPKF Laser & Electronics is a bullish idea, set out in a brief write-up. x.com 

LPKF's stock got ahead of itself, and at around €12 it is worth watching rather than buying, becoming seriously interesting below €10. The glass-substrate thesis is intact: LPKF now sizes its 2030 addressable market at €1.7B, up from €500M, targets 70% share, and is negotiating 2027 ramp orders. But H1 revenue was only €36.5M with negative EBIT and free cash flow, and a steeper ramp could need capital. Next, LPKF must prove it has won a place in the production equipment stack. x.com 

LPKF Laser & Electronics is one of the most asymmetric bets in the AI optics chain at about 7.8 times EV to gross profit, while peers trade at premium multiples. Co-packaged optics needs glass substrates, and its LIDE tools lead in crack-free through-glass vias; over 80% of major players preparing glass ramps are qualifying with its gear. Nvidia's Feynman era should multiply glass volumes and tool sales. Q1 revenue fell 27% on a temporary solar slump, and glass is still pre-volume. x.com 

LPKF Laser is a small-priced option on glass substrates becoming the next generation of AI chip packaging, with 4-10x upside if glass wins. It owns LIDE, the only working laser process that drills precise holes in glass without cracking it. Intel has committed to high-volume glass by 2030, Samsung is piloting and TSMC is evaluating. At a 293M EUR market cap it is pre-revenue inflection with no meaningful EBITDA, which is the point of the bet. x.com 

LPKF's core business is terrible, and the CEO's new LIDE target, raising its 2030 addressable market from €500 million to €1.7 billion, shifts attention to an area where nothing can yet be disproven. There is still no meaningful sign of LIDE in the order book. Revenue fell to €36.5 million from €59.2 million, order intake more than halved to €19.9 million, and adjusted EBIT fell to −€10.4 million. Electronics, carrier of the future narrative, grew just €0.6 million and lost the most. x.com 

LPKF's earnings release shows its future in glass advanced packaging, even as current results look weak. Leading chipmakers are deploying its LIDE technology, and follow-on orders confirm it as key for crack-free glass processing. LPKF is expanding into glass package singulation and laser bonding of multilayer glass stacks, and working on co-packaged optics on glass. @ren_stocks notes revenue fell to €17.1M with a -40% EBIT margin, but the case rests on 2027 LIDE glass-core mass production. … Show more

LPKF Laser is a bottleneck supplier for glass substrates, the next-generation AI packaging material Intel, Samsung and TSMC are piloting. Glass cracks when drilled, and LPKF's LIDE is one of very few processes that structure glass at production scale without cracking, so no glass ecosystem gets built without a tool like it. Management says the question is now when the ramp begins, not whether. Besi trades at 77x EBITDA on advanced packaging; upstream names trade at fractions of that. x.com 

LPKF's glass-substrate story got priced in far ahead of reality, and high-volume scaling is still a 2027+ story. Its raised €1.7B 2030 TAM overstates the obtainable market once competitors, yields and dual-sourcing kick in, and the CEO said it is premature to call a supply-chain breakthrough. H1 revenue fell 38.3% to €36.5M as solar collapsed, adjusted EBIT was -€10.4M, and restructuring costs eat 3-4% of revenue. LIDE remains strategically important; 2028 margin execution is the thing to watch. … Show more

LPKF's volume ramp likely tracks glass-core substrate mass-production timelines, which have just slipped. Samsung Electro-Mechanics pushed its start to 2028 from H2 2027 after customer reliability evaluations of prototypes bottlenecked, and SKC's Absolics moved to H1 2027 from H2 2026, per TrendForce. Timeline shifts aren't always good news, but the shift to glass-core substrates still feels imminent. x.com