LPKF's glass-substrate thesis has barely started even after the stock's run. Its LIDE process drills defect-free through-glass vias at production speed with aspect ratios up to 1:50, and glass is the only material that solves CTE mismatch, dielectric loss and warpage at once, where silicon interposers cannot scale. Over 80% of major players chose LPKF equipment for validation, a de facto standard; first production orders came in Q1 2026, and the 2027 mass-production ramp hits the P&L hard. x.com 

LPKF Laser is a bottleneck supplier for glass substrates, the next-generation AI packaging material Intel, Samsung and TSMC are piloting. Glass cracks when drilled, and LPKF's LIDE is one of very few processes that structure glass at production scale without cracking, so no glass ecosystem gets built without a tool like it. Management says the question is now when the ramp begins, not whether. Besi trades at 77x EBITDA on advanced packaging; upstream names trade at fractions of that. x.com 

LPKF's management credibility is the biggest concern after years of overpromising. It missed 2024 and 2025 guidance and is on track to miss 2026, needing H2 revenue of twice its €34.7 million backlog. Expected Q2 production orders for LIDE systems did not arrive and were pushed to H2, and its €1.7 billion advanced-packaging TAM assumes everyone switches fully to glass in 2030. Its technology is great and it leads in TGV, but glass substrates need a couple more years to penetrate meaningfully. … Show more

LPKF Laser & Electronics is a bullish idea, set out in a brief write-up. x.com 

LPKF Laser & Electronics is one of the most asymmetric bets in the AI optics chain at about 7.8 times EV to gross profit, while peers trade at premium multiples. Co-packaged optics needs glass substrates, and its LIDE tools lead in crack-free through-glass vias; over 80% of major players preparing glass ramps are qualifying with its gear. Nvidia's Feynman era should multiply glass volumes and tool sales. Q1 revenue fell 27% on a temporary solar slump, and glass is still pre-volume. x.com 

LPKF faces mostly lumpy, cancelable pilot-line revenue until 2029, while the market already prices in much of its glass substrate option. Volume demand for its glass equipment hinges on TSMC and NVIDIA choosing glass for CoPoS panel packaging; that wave lands around 2028-29 and could slip to end-2030 on warpage and yield issues. Absolics' and Semco's 2027 plans are qualification. The real signals are TSMC's CoPoS tool-vendor selection and an LPKF order above EUR 10M naming a Tier-1 customer. … Show more

LPKF Laser is a small-priced option on glass substrates becoming the next generation of AI chip packaging, with 4-10x upside if glass wins. It owns LIDE, the only working laser process that drills precise holes in glass without cracking it. Intel has committed to high-volume glass by 2030, Samsung is piloting and TSMC is evaluating. At a 293M EUR market cap it is pre-revenue inflection with no meaningful EBITDA, which is the point of the bet. x.com 

LPKF's earnings release shows its future in glass advanced packaging, even as current results look weak. Leading chipmakers are deploying its LIDE technology, and follow-on orders confirm it as key for crack-free glass processing. LPKF is expanding into glass package singulation and laser bonding of multilayer glass stacks, and working on co-packaged optics on glass. @ren_stocks notes revenue fell to €17.1M with a -40% EBIT margin, but the case rests on 2027 LIDE glass-core mass production. … Show more

LPKF Laser & Electronics and Schmid Group shares should deflate fast because glass-core substrates are not expected to be adopted until 2030, per @AtlasShrug1 citing @pequityresearch, a long wait for any ramp. x.com 

LPKF could re-rate if its H2 2026 volume ramp arrives, as a named LIDE production order would validate the 2027 glass-core timeline and its new €1.7B 2030 market estimate. H1 was ugly, with revenue down 38.3% and cash at €4.0M, but FY26 guidance of €105-120M implies roughly doubling in H2 against a €34.7M backlog. Samsung Electro-Mechanics, JNTC and Absolics target glass-core production in 2027, when TSMC has a CoPoS pilot line slated. Hold as a moonshot; trim on a dilutive raise before orders. … Show more