Shunsin's valuation could rebuild as CPO work lifts gross margins from the traditional OSAT range of 15-16% to 30-35% on CPO and 1.6T products. As Foxconn's packaging affiliate, it handles the high-precision FAU optical alignment step in Nvidia's CPO supply chain. Its ShunYun unit signed a mass-production OSAT deal with Enablence in March 2026, Vietnam capacity avoids tariffs, and Apple Watch SiP adds diversification. It is early and small, the kind of name that re-rates violently. x.com 

Taiwan Semiconductor's above-average inflows and potential capitulation at the recent low add to its bullish setup. The stock has moved cleanly off the STL and out of the pink zone. x.com 

Shunsin Technology can keep rising sharply even after tripling since March, because the market underestimates next year's co-packaged optics shipments, provided Nvidia's Rubin Ultra reaches mass production on time. x.com 

TSMC may lose pricing power as performance gains shift from shrinking transistors to stacking, interconnects and optics, while logic folding could make older processes competitive. Despite strong leading-edge demand, investors may overestimate the profit share its node leadership can retain. Its cautious expansion and past reluctance toward advanced packaging suggest a risk-averse culture that protects returns but could leave it late to disruptive technologies and key customers. x.com 

TSMC should benefit as CoWoS packaging is relieved, because the extra volume flows back into its front-end fabs. Per TrendForce, TSMC is taking CoWoS from about 130k wafers a month at end-2026 to 260k by end-2028, while 2nm and 3nm also grow. C.C. Wei said outside packaging capacity helps the wafer business, still most of TSMC. OSATs can win packaging while TSMC owns the bigger upstream prize. The view fails if CoWoS alternatives ramp and TSMC's HPC wafer growth stalls. x.com 

Putting CPO optical engines in the interposer should make TSMC the leader at that packaging task. The OCI-MSA diagram shows an optical engine mounted on a high-density interposer; GlobalFoundries has a modest agreement in the area, but should not be expected to earn the same profit. x.com 

Taiwan equities bundle real AI chokepoints with pricing power and no near-term substitutes for about 21x forward earnings, versus about 30x for US semiconductors. TSMC holds about 90% of sub-7nm manufacturing and is raising CoWoS prices; Unimicron and Elite Material control ABF substrates and CCL; ASE runs advanced packaging above 90% utilization; Delta supplies power and cooling for 120-230kW racks at 30-40% lower cost than Western rivals. Taiwan also offers lower beta and volatility. x.com  … Show more

TSMC's earnings set the stage for a strong reporting season. Hold the line on TSMC despite its shares being caught in SOXX's algorithmic sell-off; StockMKTNewz reported that TSMC beat quarterly revenue and EPS estimates. x.com 

Xintec offers TSMC's co-packaged optics testing bottleneck at a huge discount. TSMC's COUPE volume production starts this year with wafer-level testing flagged as one of three critical scaling challenges, and TSMC plans to pursue CPO with its subsidiary Xintec, which is ramping wafer testing capacity for second-half 2026 growth. 90% trial yields on 310mm pilot lines suggest technical risk is falling faster than its roughly $2.18B market cap reflects. x.com 

Soitec looks compelling again because the market misunderstands its book value, its underutilized fabs and the wafer area co-packaged optics will need. Depreciation on idle capacity is compressing earnings. @WalterA09213626, whose post is quoted, notes the share price fell from an all-time high of €200 to €116 over the past month. x.com