Amkor and ASE gain as TSMC's advanced-packaging spillover grows, making this the season for outsourced packaging. The share of spillover customers at TSMC has risen drastically, so the Amkor partnership was the viable option, and ASE has huge opportunities too. A post the author replies to calls packaging the biggest bottleneck, with chiplets, compute-memory stacking and silicon photonics driving growth. x.comÂ

