The semiconductor cycle looks stronger than ever because repeated delays in next-generation technology extend the life of existing solutions. When engineering hits a breaking change, customers lean on older approaches, keeping bonding techniques such as MR-MUF relevant for much longer, which is better for the industry. @jukan05 notes hybrid bonding may not be used even in HBM5. Likewise, Nvidia's Rubin NVL72 Oberon racks become more relevant on the path to Kyber. x.com




