LPKF's LIDE technology is production-ready and winning as AI accelerators shift to glass substrates. Glass substrates with high-density through-glass vias deliver better thermal and electrical performance and scalability than organic or silicon for high-power AI chips and data centers, making packaging a key part of the AI buildout. CEO Klaus Fiedler bought shares last month. x.com 

LPKF could re-rate if its H2 2026 volume ramp arrives, as a named LIDE production order would validate the 2027 glass-core timeline and its new €1.7B 2030 market estimate. H1 was ugly, with revenue down 38.3% and cash at €4.0M, but FY26 guidance of €105-120M implies roughly doubling in H2 against a €34.7M backlog. Samsung Electro-Mechanics, JNTC and Absolics target glass-core production in 2027, when TSMC has a CoPoS pilot line slated. Hold as a moonshot; trim on a dilutive raise before orders. … Show more

LPKF looks a bit expensive after its recent share price run, even on @BrainyMarsupial's bullish meeting notes, which see at least three players ordering glass-substrate machines this year. Revenue remains difficult to forecast and a higher valuation cannot be counted on, which makes it hard to add more. x.com  x.com 

LPKF's glass-substrate thesis has barely started even after the stock's run. Its LIDE process drills defect-free through-glass vias at production speed with aspect ratios up to 1:50, and glass is the only material that solves CTE mismatch, dielectric loss and warpage at once, where silicon interposers cannot scale. Over 80% of major players chose LPKF equipment for validation, a de facto standard; first production orders came in Q1 2026, and the 2027 mass-production ramp hits the P&L hard. x.com 

LPKF Laser & Electronics is one of the most asymmetric bets in the AI optics chain at about 7.8 times EV to gross profit, while peers trade at premium multiples. Co-packaged optics needs glass substrates, and its LIDE tools lead in crack-free through-glass vias; over 80% of major players preparing glass ramps are qualifying with its gear. Nvidia's Feynman era should multiply glass volumes and tool sales. Q1 revenue fell 27% on a temporary solar slump, and glass is still pre-volume. x.com 

LPKF's risk-to-reward is no longer attractive after a 60% run in a few days with no fundamental change at the company. With the valuation that much higher, the risk is now greater than the reward, even though the upside could still be huge. The thesis itself is intact, and quarterly earnings don't change it: the ramp that matters starts next year. x.com  x.com 

Lightwave Logic, LPKF and Sivers are picks-and-shovels bets on AI bottlenecks: whoever solves heat dissipation and packaging wins the next decade. NVIDIA's roadmap shows it quietly depends on these technologies, making them structural necessities, with upside well beyond 10x if they become global standards. Lightwave Logic and LPKF are the top picks, and conviction in Sivers on optics is high. Losses are normal at this stage; once they turn profitable, a 3x share gain is plausible. x.com  x.com 

LPKF has a fresh trigger: @aleabitoreddit found it listed as a SpaceX supplier in SpaceX's US import logs, though what the contract covers is unclear. The thesis that glass will replace organic substrates is as relevant as ever. x.com 

LPKF's stock got ahead of itself, and at around €12 it is worth watching rather than buying, becoming seriously interesting below €10. The glass-substrate thesis is intact: LPKF now sizes its 2030 addressable market at €1.7B, up from €500M, targets 70% share, and is negotiating 2027 ramp orders. But H1 revenue was only €36.5M with negative EBIT and free cash flow, and a steeper ramp could need capital. Next, LPKF must prove it has won a place in the production equipment stack. x.com 

LPKF Laser & Electronics is a bullish idea, set out in a brief write-up. x.com