Intel's 18A-P looks like the only option for SK Hynix's and Micron's HBM4 base dies. TSMC's N5 and below is booked, SK Hynix's N12 base die apparently still has problems, and Micron's internal base die is doubtful. N7 and Intel 3 are not viable for HBM4 base dies. Korean media report Samsung is considering adding 4nm capacity and a 2nm line for surging HBM4 base-die demand, and has raised prices on new 4nm foundry orders. x.comÂ



