Samsung Electro-Mechanics is breaking into AI packaging by supplying silicon capacitors for Intel's EMIB, which is why the stock is surging. TSMC sourced silicon capacitors in-house, shutting outsiders out, but Intel must buy them. SEMCO is the only company with both silicon capacitor and substrate businesses, the top-value EMIB part, so it can supply both turnkey with strong bargaining power. It won a contract over $1B versus a few million dollars of such revenue last year. x.com 

Samsung Electro-Mechanics is emerging as an AI infrastructure titan as advanced substrates become the bottleneck for AI scaling. Per @jukan05, it will supply FC-BGA substrates for Broadcom's most advanced AI accelerators from the second half, joining NVIDIA, Google, Amazon and Apple. With Ibiden and Shinko at full capacity, it is the only tier-1 player with the capex to scale large-area substrates. AI servers also need 3-4x more MLCCs, where Samsung and Murata own the IP and earn premium margin. … Show more

Murata, Samsung Electro-Mechanics, Taiyo Yuden, Yageo and TDK look priced too hot even though MLCC fundamentals are booming. Taiyo Yuden cautioned that with 30-week lead times, ODMs are buffering inventory and part of the order book is panic buying. Samsung Electro-Mechanics' CFO said low-to-mid tier margins could face pressure in 18-24 months as Chinese rivals expand. Morgan Stanley and Citi analysts warned that at forward P/Es above 40x, any late-2026 capex slowdown could hit multiples hard. … Show more

Silicon capacitors are in tight supply and could take off the way MLCC makers did, with Murata, Samsung Electro-Mechanics and AP Memory the most exposed. Per @jukan05, Samsung Electro-Mechanics is demolishing a parking lot to build a new fab because ABF substrate demand is so strong and it lacks greenfield space. x.com 

Murata, Samsung Electro-Mechanics and Taiyo Yuden benefit from a narrow shortage of the high-capacitance, low-inductance MLCCs AI accelerators need, even as commodity capacitor pricing stays soft. MLCC content per rack rises from about $1,530 in GB300 to $4,320 in VR200. Taiyo Yuden's book-to-bill is about 1.7x, Murata's high-end utilization about 95%, and SEMCO raised prices 30%. Murata has the strongest position, SEMCO the clearest earnings conversion, Taiyo Yuden the cleanest exposure. x.com  … Show more

High-end ABF substrates are the next AI hardware bottleneck, giving Samsung Electro-Mechanics a large opportunity, per Meritz Securities. As AI accelerators scale, package areas are growing over 5x and pin counts up to 100x, while Ajinomoto, with over 90% of raw film supply, is maxed out and Ibiden runs at full capacity. Samsung Electro-Mechanics is rapidly expanding FC-BGA capacity to capture unallocated GPU demand, and Nvidia's 2028 Feynman chips may need 3-5x the substrate of 2026 designs. … Show more

Inference's move toward edge devices and dense, memory-hungry racks should drive demand for specialized chips, links, power delivery and cooling. McKinsey projects inference at 60% of AI computing demand by 2030. Ambarella makes on-device AI chips; Astera Labs links GPUs, memory and networks; Credo supplies short copper connections; Rambus earns from memory interfaces; Navitas reduces power waste; Modine cools dense racks; and Super Micro builds inference-specific server racks at volume. x.com  … Show more

TSMC's capex plans suggest the AI chip trade is not over for semiconductors, Nvidia, AMD and Micron. CFO Wendell Huang cites robust multi-year demand, including agentic AI, behind $60-64 billion of 2026 capex; TSMC expects 2026-28 spending to be even more significantly higher than in the prior three years. Hyperscaler earnings should reinforce the higher AI capex trajectory. CoreWeave-driven fears feel overdone, though the neocloud model does not appeal long term. x.com  x.com 

Samsung Electro-Mechanics has booming profits from MLCCs and FCBGA substrates, backed by huge demand through long-term agreements with hyperscalers. It may be preferable to Samsung Electronics right now, since there are better pure-play memory names than Samsung Electronics. x.com 

These ten companies span every layer of AI capex, which Goldman sees surging to $1.2 trillion in 2027, so each should make money. Credo, Broadcom, Micron, Nvidia, TSMC, AMD and Amkor cover connectivity, custom chips, memory, GPUs, foundry and packaging; Broadcom expects AI revenue of about $115B in fiscal 2027. Vistra supplies power under 20-year nuclear contracts. IREN and Nebius rent AI compute, with Nebius targeting $7-9B run-rate revenue by year end. x.com  x.com  x.com  x.com  x.com  x.com  x.com  … Show more