High-end ABF substrates are the next AI hardware bottleneck, giving Samsung Electro-Mechanics a large opportunity, per Meritz Securities. As AI accelerators scale, package areas are growing over 5x and pin counts up to 100x, while Ajinomoto, with over 90% of raw film supply, is maxed out and Ibiden runs at full capacity. Samsung Electro-Mechanics is rapidly expanding FC-BGA capacity to capture unallocated GPU demand, and Nvidia's 2028 Feynman chips may need 3-5x the substrate of 2026 designs. … Show more

Broadcom's reported Samsung deal is very bullish because it secures 2nm foundry, HBM memory and advanced packaging for its custom AI accelerators. Per @FinnStockinger, the deal is estimated above $200B through 2030 and makes Samsung a one-stop shop delivering finished modules, so Broadcom need not fight for limited TSMC capacity. He flags Samsung's yield execution as the biggest wild card. x.com 

Glass-core substrate suppliers such as Corning, LPKF, Samsung Electro-Mechanics, SKC and AGC remain early, as the sector is still some way from shipping real volume. Part 4 of @GyujinAAIG's glass research shows how far each group is, mapping substrate makers on a one-to-ten readiness scale and chip designers on a separate one-to-fourteen scale. x.com 

Samsung Electro-Mechanics has booming profits from MLCCs and FCBGA substrates, backed by huge demand through long-term agreements with hyperscalers. It may be preferable to Samsung Electronics right now, since there are better pure-play memory names than Samsung Electronics. x.com 

Samsung Electro-Mechanics is breaking into AI packaging by supplying silicon capacitors for Intel's EMIB, which is why the stock is surging. TSMC sourced silicon capacitors in-house, shutting outsiders out, but Intel must buy them. SEMCO is the only company with both silicon capacitor and substrate businesses, the top-value EMIB part, so it can supply both turnkey with strong bargaining power. It won a contract over $1B versus a few million dollars of such revenue last year. x.com 

Nvidia's co-investment supports Samsung Electro-Mechanics' substrate expansion because it expects capacity to be tight when it needs supply. Samsung Electro-Mechanics says dedicated compute and switch substrate supply to Nvidia starts this year, with double-digit annual volume growth; by 2028 Nvidia orders should take a substantial share of its package-substrate capacity. Global customers fund part of its 6.78 trillion won expansion, but new Sejong output starts in September 2028. x.com 

Broadcom gains capacity certainty, which is everything right now: Samsung's reported $200B AI chip partnership locks in Samsung 2nm+ foundry, next-gen HBM and advanced packaging for Broadcom's custom AI ASICs through 2030. x.com 

TSMC's latest results point to AI chip demand still running ahead of supply, supporting the semiconductor and equipment trade. Cantor says TSMC raised its 2026 revenue outlook again, guided December-quarter sales above consensus and held 65-67% gross-margin guidance through the N2 ramp; its bullish sector read names Nvidia, Broadcom, AMD, ASML, Applied Materials, Lam Research and KLA. Jensen Huang says AI labs need not reach trillions in revenue to justify the buildout. x.com  x.com 

As custom AI chips become normal, the scarce asset may be the capacity to build them, since every design passes through the same packaging, substrate, PCB material and manufacturing bottlenecks. Meta with MediaTek and Amazon with Alchip show chip design going modular. That favors TSMC for manufacturing, Alchip for ASIC back-end work, Samsung Electro-Mechanics, Ibiden and AT&S for high-end substrates, and Shengyi Technology if AI PCB material stays tight. The bottleneck map widened. x.com  x.com 

Power delivery is the least crowded way to own AI capex, as capacitance moves onto the chip package. AI chips run at about 1V while drawing 800W to over 1kW, with current spiking from 100A to 900A instantly, too fast for distant MLCCs. AP Memory, the purest silicon capacitor play, posted record Q2 revenue up 78% with SiCap up 273% to 27% of sales, and one design needs nearly 100 caps per substrate with visibility into 2028. Samsung Electro-Mechanics signed a $1B SiCap supply contract. x.com