High-end ABF substrates are the next AI hardware bottleneck, giving Samsung Electro-Mechanics a large opportunity, per Meritz Securities. As AI accelerators scale, package areas are growing over 5x and pin counts up to 100x, while Ajinomoto, with over 90% of raw film supply, is maxed out and Ibiden runs at full capacity. Samsung Electro-Mechanics is rapidly expanding FC-BGA capacity to capture unallocated GPU demand, and Nvidia's 2028 Feynman chips may need 3-5x the substrate of 2026 designs. x.comÂ











