Intel got to the next wave of chipmaking tools first: High-NA EUV reached its first high-volume production on Intel 18A. ASML's numbers point to a capacity supercycle, probably not a peak, with EUV and DUV capacity each growing about 30% a year for the next two years. That matters because ASML only expands capacity against committed demand, so the whole lithography stack is supply-constrained and building. x.com
