Unimicron should benefit from a persistent AI ABF substrate shortage and a shift toward higher-end products. Its projected share exceeds 30% as the market reaches $13bn/$18bn in 2027/28; added capacity is expected to lift ABF revenue 66%/90%. Higher-end ABF, mSAP and LPDDR lift margins, supporting 77% EPS CAGR. Initiate Buy with a NT$1,820 target at 30x 2027 earnings. x.com 

High-grade PCB and low-loss glass-fiber makers Nitto Boseki, Elite Material and Taiwan Union Technology should keep rising as the obvious workaround to an inevitable memory despec for Nvidia's Rubin Ultra and Feynman. All three have more than tripled in the past year, and some are up over 10x in three years. Switching suppliers is harder here than in memory, which is why a few firms dominate, but it is higher risk and new supply coming online has not been analyzed. x.com 

Downstream PCB makers such as Shenghong Technology are best avoided because material shortages may leave their results weaker than upstream and midstream suppliers', as a post the author replies to suggests. Shenghong's share price has not moved; the test is whether it can pass rising material costs on to its customers. x.com 

TTM Technologies is the top defense and AI PCB pick, central to AI hardware yet trading at 20.3x forward earnings versus a 25.6x median for Asian rivals. It just posted its first $1B revenue quarter at record margins, holds over 40% share on Nvidia's VR200 platform and is qualified on nearly every major AI accelerator. PCB content rises from $35k in GB300 to $116k in VR200 as layer counts climb. The CEO and a board member bought $1.6M of stock, the first insider buying after months of selling. … Show more

Low PEG ratios and continuing AI demand make leading AI stocks attractive after rolling corrections. Nvidia is at 0.39x PEG, Amazon 0.64x, Broadcom 0.66x, Micron 0.73x, Oracle 0.59x and TSMC 0.41x. This usually signals at least a local bottom, possibly a major one; midterm-year seasonality helps into year-end. Nvidia, Broadcom and Amazon remain favorites; Micron and TSMC look buyable on dips. Low PEG can mislead if growth slows or estimates are wrong. x.com 

TTM Technologies' defense-tech PCB exposure is incredibly underappreciated because the market lumps it into AI infrastructure. That infrastructure cycle is nowhere near its peak given PCB and substrate shortages. Insiders bought big; TTM looks like a no-brainer here. x.com 

IC substrates are Schmid's more relevant growth driver today because demand is already high and rising. Schmid customers Ibiden and Unimicron are expanding capacity with NVIDIA support; higher order intake supports the prospect of more equipment orders. Its balance sheet has improved, and the risk/reward looks attractive at current levels despite volatility. Glass substrates may take another one to two years to matter commercially. This is a personal assessment, not a buy recommendation. x.com  … Show more

Chinese PCB makers such as XingSen, Shennan Circuits, Victory Giant and WUS Printed Circuit should be the first in AI hardware to see capacity expansion pay off, in the third quarter. Most AI expansion lands in the second half of next year, when supply should balance or exceed demand, so the next two quarters are the earnings window, and firms that expand and profit first will hit new highs first. Thin volume and macro risks, from Nvidia's earnings to the Fed, may cap rebounds until Q3 results. … Show more

Zhen Ding remains a Buy as Nvidia's Rubin platform sharply raises PCB content per GPU. Content rises from about $440 per GPU on GB300 to about $750 on VR200 and roughly $1,000 on VR300, driven by higher-end CCL materials and rising layer counts. If PTFE is adopted in Rubin Ultra-era boards, content could exceed $1,500 per GPU. Zhen Ding has a new position in the VR200 compute tray. x.com 

Simmtech is the cleanest winner as Nvidia shifts to more, lower-capacity SoCAMM2 modules, as the only supplier capturing both the module PCB and the LPDDR substrate, with ₩40-50B of SOCAMM revenue guided this year. ISC gains purely on unit count, since test sockets are consumed per device. Korea Circuit and Tripod add module-PCB exposure and Argosy's connector is per-module; Daeduck gets only the total-demand uplift, and Doosan's slice is small here, though it may be Rubin's biggest winner. … Show more